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QZ5550
Low Silicon Brass
UNS Number :
C85550
Properties and Specifications
Applications
Available Forms
Physical Properties
Density | Thermal Conductivity | Electrical Conductivity% IACS at 68°F | Antimicrobial |
|---|---|---|---|
8.36 | 19.13 | Yes |
Chemical Composition
Cu | Pb | Sn | Zn | Fe | P | Ni | AL | Mg | Mn | Sb | Si | Ag | Cr | As | Bi | Nb | Se |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
59-64% | 0.09 Max | 0.3% Max | Rem Zn | 0.15% Max | 0.2% Max | 0.3% Max | 0.3-1% |
Mechanical Properties
Tensile | Yeild Strength | Elongation % | Hardness (Brinell) | Fatigue Strength |
|---|---|---|---|---|
420 MPa / 60.9 ksi Typ | - | 25 | - | - |
Fabrication Properties
Soldering | Brazing | Oxyacetylene Welding | Gas Shielded Arc Welding | Coated Metal Arc Welding |
|---|---|---|---|---|
Excellent | Excellent | Excellent | Fair | Poor |
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